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Process solutions for the digital age

Telecommunication & Digitalization

Technology solutions for the digital age

Telecommunications is the exchange of data using electronics and electrical engineering. Wherever electronic components are located, our process technologies dispensing, plasma pretreatment and joining with heat staking are used. The electronic components and electronic parts must be efficiently protected against any external and damaging effects such as dirt, moisture and extreme temperature fluctuations.  

Our dispensing systems can be used for various dispensing applications such as potting or dispensing thermally conductive materials on electronic components. The use of our plasma systems optimally prepares component surfaces for a subsequent dispensing process such as bonding. This ensures long-term adhesion. The heat staking joining technology is used to join all thermoplastics or thermoplastic materials with other materials such as metals. This makes screws unnecessary and is gentle on components. 

Telecommunication & Digitization

Innovative process solutions

bdtronic offers a comprehensive process portfolio consisting of dispensing technology, plasma pretreatment and heat staking for customer-oriented solutions along the entire value chain in the telecommunications industry. Together with our customers and our international material partners, we jointly develop the optimal technology solution.

Technology solutions for telecommunications and digitization

The rollout of 5G networks is progressing in leaps and bounds. Higher frequencies and the associated increased signal loss require a densification of network installations. As a result, significantly more small (pico or femto) stations are being used. Optimal thermal management solutions are just as important here as the protection of sensitive electronics.

Dispensing

5G Base stations

A thermal paste is dispensed into the casing for optimal heat management. A liquid seal is applied to the case to prevent moisture from entering the interior.

Plasma

Base stations for LTE networks

Plasma pretreatment is used to achieve better adhesion of the adhesive to the housing.

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Review: Practical Seminar on Dispensing Technology

Why does the system react this way and not another? Where is the error that keeps creeping in? What could work better – if only there were a moment to take a closer look? These were exactly the questions answered at the Practical Seminar on Dispensing Technology from March 3rd to 4th. Two days where technology was experienced, discussed, and understood together.

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Whitepaper: 2K Wicking

Less energy. Shorter cycles. Lower investments. Find out how this works in series production – read now.

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Design Guideline BHS HOT STAMP® & BHS HOT AIR®

Guidance on pin design and tool dimensioning for heat staking applications.

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Events

Date: 10.6.2026. 2:00:00 PM
Novi, MI, USA
Messe & Konferenz

Coiltech North America

From June 10–11, 2026, bdtronic will present the latest developments in powder coating and impregnation solutions for EV/HEV motors at Coiltech North America 2026 in Novi, MI at booth F30.